Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package

A method for making a multipackage module having a second die and a second package stacked over a first package, comprising:

• providing the first package, comprising a first package die affixed to a first package substrate, the active surface of first package the die facing away from the first package substrate;
• affixing a spacer onto a spacer attach region of the active surface of the first package die;
• affixing a second die onto a second die attach region of the active surface of the first package die, the second die attach region being outside the spacer attach region;
• interconnecting the first package die to the first package substrate by wire bonds;
• interconnecting the second die to the first package substrate by wire bonds;
• providing a second package, comprising a second package die affixed to a second package substrate, the die being interconnected to the substrate by wire bonds;
• molding to cover the second package die and the wire bonds associated therewith, a surface of the molding forming a surface of the second package;
• affixing the second package onto the spacer, the molding surface facing the spacer;
• interconnecting the second package to the first package by wire bonds;
• and
• molding to cover the second package and wires associated therewith, the second die and wires associated therewith, and exposed parts of the first package die and first package substrate and wires associated therewith.