Embossing Printing for Fabrication of Organic Field Effect Transistors and its Integrated Devices
AssigneeNanyang Technological University
InventorsChang Ming LI, Mary Bee Eng Chan, Jun Zhang
Life of this patent
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Abstract
A method of fabricating an organic field effect transistor (OFET) includes forming at least one OFET structure by ultraviolet (UV) transfer embossing printing, where, in an example embodiment, the method includes providing ink material on at least part of a patterned surface of a mold, where the mold 100 is then contacted on a coating of ultraviolet (UV) curable resin on a substrate so as to insert at least part of the ink material into the resin, the resin is then irradiated with UV light, and the mold is separated from the resin so as to transfer the ink material onto the substrate to form at least one OFET structure.
Claims19
1-30. (canceled)
A method of fabricating an organic field effect transistor (OFET), the method comprising:
- providing ink material on at least part of a patterned surface of a mold;
- contacting the mold on a coating of ultraviolet (UV) curable resin on a substrate so as to insert at least part of the ink material into the resin;
- irradiating the resin with UV light;
- and
- separating the mold from the resin so as to transfer the ink material from at least part of the patterned surface of the mold onto the resin to form at least one OFET structure.
The method of claim 8 further comprising:
- unwinding the flexible transparent substrate from a reel;
- dispensing the UV curable resin onto the substrate near the reel;
- and
- smoothing the resin to form a coating as the substrate is unwound from the reel.
Dependencies are inferred from the claim text.