Method of manufacturing optical component and optical component
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsKazumasa Adachi, Motoo Takada, Kozo Ono
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Abstract
To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.
Claims6
A method of manufacturing an optical component used by transmitting light through an inside thereof, the method comprising:
- a step of forming a first buffer layer made of an amorphous inorganic substance causing a brittle fracture on a surface of a first substrate made of an optical material substrate;
- a step of forming a second buffer layer made of an amorphous inorganic substance causing a brittle fracture on a surface of a second substrate made of an optical material substrate having a linear expansion coefficient different from that of the first substrate;
- a step of then stacking the first buffer layer and the second buffer layer to perform a heat treatment, and bonding both of the substrates via the first buffer layer and the second buffer layer to obtain a stack;
- and
- a step of thereafter cutting off the stack in a stacking direction by a scribing process to obtain a piece for an optical component.
An optical component being an optical component used by transmitting light through an inside thereof, the optical component comprising:
- a first substrate made of an optical material substrate;
- a second substrate made of an optical material substrate having a linear expansion coefficient different from that of said first substrate;
- and
- a buffer layer formed between said first substrate and said second substrate and made of an amorphous inorganic substance causing a brittle fracture.
Dependencies are inferred from the claim text.