Pressure-sensitive adhesive layer-carrying transparent conductive film and method for production thereof
AssigneeNitto Denko Corporation
InventorsHidehiko Andou, Hideo Sugawara, Tomotake Nashiki
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AssigneeNitto Denko Corporation
InventorsHidehiko Andou, Hideo Sugawara, Tomotake Nashiki
Estimating the term…
An object of the invention is to provide a transparent conductive film having good processability and to provide a method for production thereof. The pressure-sensitive adhesive layer-carrying transparent conductive film of the invention comprises: an amorphous transparent conductive laminate comprising a transparent plastic film substrate and an amorphous transparent conductive thin film provided on one side of the transparent plastic film substrate; a pressure-sensitive adhesive layer; and a release film that is provided on another side of the transparent plastic film substrate with the pressure-sensitive adhesive layer interposed therebetween and comprises at least a film substrate, wherein the release film is thicker than the amorphous transparent conductive laminate, and a value obtained by subtracting the thermal shrinkage percentage of the release film in the MD direction from the thermal shrinkage percentage of the amorphous transparent conductive laminate in the MD direction is from −0.3% to 0.45%.
A pressure-sensitive adhesive layer-carrying transparent conductive film, comprising:
Dependencies are inferred from the claim text.