Cleaning of a substrate support
AssigneeApplied Materials, Inc.
InventorVijay D. Parkhe
Life of this patent
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Abstract
A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface is disclosed. The method comprises providing a cleaning disc, and applying a liquid polymer precursor to the cleaning disc by spraying or spin coating the liquid polymer precursor onto the disc to form a polymer precursor film on the disc. The polymer precursor film is cured to form a polymer layer having a cleaning surface.
Claims20
A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface, the method comprising:
- (a) providing a cleaning disc;
- and
- (b) applying a liquid polymer precursor to the cleaning disc by spraying or spin coating the liquid polymer precursor onto the disc to form a polymer precursor film on the disc;
- and
- (c) curing the polymer precursor film to form a polymer layer having a cleaning surface.
A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface, the method comprising:
- (a) providing a cleaning disc;
- and
- (b) applying a liquid polyimide precursor to the cleaning disc by spraying or spin coating the liquid polyimide precursor onto the disc to form a polyimide precursor film on the disc;
- and
- (c) curing the polyimide precursor film to form a polyimide layer having a cleaning surface.
A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface, the method comprising:
- (a) providing a silicon disc;
- and
- (b) spin coating a liquid polyimide layer onto the silicon disc to form a polyimide precursor film on the silicon disc;
- and
- (c) curing the polyimide precursor film to form a polyimide layer having a cleaning surface.
Dependencies are inferred from the claim text.