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US 2010/0135764 A1Published application
Magnetically coupled thin-wafer handling system
AssigneeIntel Corporation
InventorsJeff Wienrich, Charles Singleton
Life of this patent
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Abstract
The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.
Claims21
A method comprising:
- separating magnets and corresponding target plates, said corresponding target plates facing said magnets;
- separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system;
- and
- inserting or removing a thin wafer from said thin-wafer handling system.
1 more element
An apparatus comprising:
- a lower support assembly;
- an upper retainer assembly disposed over said lower support assembly;
- magnets and corresponding target plates attracting each other to hold said lower support assembly and said upper retainer assembly together;
- and
- a device to separate said magnets and said corresponding target plates.
2 more elements
An apparatus comprising:
- a solid tray;
- a thin wafer disposed over said solid tray;
- a peripheral ring disposed over said thin wafer;
- magnets and corresponding target plates attracted to each other, wherein said magnets and said target plates hold said solid tray and said peripheral ring together in a closed configuration;
- and
- a device to push apart said magnets and said corresponding target plates to separate said solid tray and said peripheral ring in an opened configuration to insert or remove said thin wafer.
3 more elements
Dependencies are inferred from the claim text.