Integrated circuit package
AssigneeThales Holdings UK PLC
InventorEmmanuel Loiselet
Life of this patent
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Abstract
An integrated circuit package comprising at least two printed circuit boards each comprising a substrate coated with metallic layers on both sides and having plated through-holes for electrical and thermal connection to the metallic layers, at least two of the printed circuit boards being diffusion-bonded at an interface between their respective metallic layers, the bonded metallic layers forming an hermetic seal between the opposed external surfaces of the integrated circuit package.
Claims11
An integrated circuit package comprising at least two printed circuit boards, each printed circuit board comprising a substrate coated with metallic layers on both sides, wherein:
- each printed circuit board is configured to have a plurality of plated through-holes for electrical and thermal connection to the metallic layers;
- and
- at least two of the printed circuit boards are diffusion-bonded at an interface between their respective metallic layers to form diffusion-bonded metallic layers, the diffusion bonded metallic layers configured to form an hermetic seal between opposed external surfaces of the integrated circuit package.
A method of making an integrated circuit package, the integrated circuit package comprising at least two printed circuit boards, each printed circuit board comprising a substrate coated with metallic lavers on both sides, comprising the following steps:
- forming a plurality of plated through-holes in each printed circuit board for electrical and thermal connection to the metallic layers;
- and
- diffusion-bonding at least two of the printed circuit boards at an interface between their respective metallic layers to form diffusion-bonded metallic layers, the diffusion bonded metallic lavers configured to form an hermetic seal between the opposed external surfaces of the integrated circuit package,
- wherein the method further comprises diffusion-bonding opposed surfaces of at least two of the printed circuit boards at the interface.
Dependencies are inferred from the claim text.