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US 2010/0134993 A1Published application
Electronic component, circuit board, electronic apparatus, and method for manufacturing electronic component
AssigneeSeiko Epson Corporation
InventorsHaruki ITO, Nobuaki HASHIMOTO
Life of this patent
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Abstract
An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug.
Claims7
An electronic component comprising:
- a semiconductor substrate having a first surface and a second surface opposing to the first surface;
- a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface;
- an electronic element provided in the vicinity of the first surface of the semiconductor substrate;
- a sealing member that seals the electronic element between the sealing member and the first surface;
- an integrated circuit which is provided on the second surface of the semiconductor substrate, and drives and controls the electronic element;
- and
- a second member having a third surface that faces the first surface,
- wherein the electronic element and the integrated circuit are electrically connected to the trans-substrate conductive plug, and
- wherein the electronic element is provided spaced apart from the first surface, and is provided on the third surface.
6 more elements
Dependencies are inferred from the claim text.