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US 2010/0134992 A1Published application
Embedding Thin Film Resistors in Substrates in Power Delivery Networks
AssigneeIntel Corporation
InventorsMyitzu Soe Myat, Mooi Ling Chang, Eu Soon Lee, Yongki Min, King Keong Wong
Life of this patent
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Abstract
Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples.
Claims9
An apparatus comprising:
- a packaged integrated circuit including an integrated circuit and an integrated circuit package packaging said circuit, said package having a capacitance;
- and
- an integrated resistor integrated in said integrated circuit, said resistor in series with said package capacitance in a power discharge path of said capacitance to ground.
Dependencies are inferred from the claim text.