Chip embedded printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHong Won Kim, Sung Yi, Tae Sung Jeong, Joon Seok Kang
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Abstract
The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.
Claims16
A chip embedded printed circuit board comprising:
- an insulating layer embedding a chip provided with posts at an upper part;
- vias formed through the insulating layer;
- upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias;
- and
- lower patterns formed at a lower part of the insulating layer to be connected to the vias.
A manufacturing method of a chip embedded printed circuit board comprising:
- mounting a chip provided with posts at an upper part over a metal film;
- forming an insulating layer penetrated by the chip provided with the posts over the metal foil;
- forming via holes to expose a portion of a top surface of the metal foil by removing a portion of the insulating layer;
- forming vias by filling the via hole with conductive material;
- forming upper patterns connected to the posts and the vias on the insulating layer;
- and
- forming lower patterns connected to the vias by removing a portion of the metal foil.
Dependencies are inferred from the claim text.