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US 2010/0134990 A1Published application
Composite electronic component and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsSatoru NODA, Jun HARADA
Life of this patent
Estimating the term…
Abstract
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
Claims8
A composite electronic component comprising:
- a supporting substrate;
- at least two of a multilayer wiring block having a plurality of laminated insulating layers and a wiring pattern, a chip-type electronic component built-in multilayer block having a plurality of laminated insulating layers and including a plurality of first chip-type electronic components disposed on different ones of the plurality of laminated insulating layers and facing in the same direction, and a second chip-type electronic component composed of a passive component or an active component disposed on a surface of the supporting substrate;
- wherein
- the at least two of the multilayer wiring block, the chip-type electronic component built-in multilayer block, and the second chip-type electronic component are electrically interconnected and arranged on the surface of the supporting substrate so as to be arranged in substantially the same plane;
- wherein the supporting substrate includes only one or two layers.
2 more elements
Dependencies are inferred from the claim text.