Power semiconductor apparatus

A power semiconductor apparatus comprising:

• a plurality of power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which a plurality of external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof;
• and a conductive connecting member having the plurality of external terminals, the power semiconductor apparatus being configured so that:
• the surfaces of the power semiconductor units that have the insertion holes of the tubular sockets are arrayed in the same direction in the plurality of power semiconductor units;
• and
• electrical wiring connection between the plurality of power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plurality of power semiconductor units.