Over-Voltage Protection Device and Method for Manufacturing thereof
AssigneeCyntec Co., Ltd.
InventorsCHUNG-HSIUNG WANG, Hung-Ming LIN, Kuo-Shu CHEN, Wen-Shiang LUO
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Abstract
An over-voltage protection device and a method for manufacturing the over-voltage protection device are provided. The over-voltage protection device includes a substrate, a pair of electrode layers, a mask layer, and a sealing layer. The electrode layers are disposed on the substrate, and a gap is formed between the electrode layers. The mask layer is disposed over the gap and a portion of the electrode layers. The sealing layer covers the mask layer and the gap.
Claims20
A method for manufacturing an over-voltage protection device, comprising:
- providing a substrate;
- forming a first photoresist layer on said substrate;
- forming a patterned metal layer on said first photoresist layer;
- exposing and developing said first photoresist layer to expose a portion of said substrate, whereby said patterned metal layer is used as a mask;
- removing said patterned metal layer;
- forming a pair of electrode layers on said exposed portion of said substrate, whereby a gap is disposed between said electrode layers;
- and
- forming a sealing layer covering said gap.
An over-voltage protection device, comprising:
- a substrate;
- a pair of electrode layers disposed on said substrate, wherein a gap is formed between said electrode layers;
- a mask layer disposed over said gap and a portion of said electrode layers, wherein a clearance exists between said mask layer and said electrode layers;
- and
- a sealing layer covering said mask layer and said gap.
A method for manufacturing an over-voltage protection device, comprising:
- providing a substrate;
- forming a pair of electrode layers on said substrate, wherein a gap exists between said electrode layers;
- forming a mask layer over said gap and a portion of said electrode layers;
- and
- forming a sealing layer covering said mask layer and said gap.
Dependencies are inferred from the claim text.