US 2010/0134675 A1 · SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

Abstract

A solid-state imaging device according to the present invention includes a semiconductor substrate, a solid-state imaging element formed on the semiconductor substrate, and a transparent member placed on the solid-state imaging element. The solid-state imaging element includes light receiving units each of which is formed on the semiconductor substrate, and digital microlenses each of which is formed above an associated one of the light receiving units. Each of the digital microlenses has protruding portions and recessed portions, and each of the protruding portions and the recessed portions are alternately arranged in a concentric pattern. The protruding portions are placed in contact with the transparent member, and the recessed portions make no contact with the transparent member.

Claims10

Dependent claims

A solid-state imaging device comprising:

a semiconductor substrate;
a solid-state imaging element formed on said semiconductor substrate;
and
a transparent member placed on said solid-state imaging element,
wherein said solid-state imaging element includes:
light receiving units each of which is formed on said semiconductor substrate;
and
digital microlenses each of which is formed above an associated one of said light receiving units,
each of said digital microlenses has protruding portions and recessed portions, each of said protruding portions and said recessed portions being alternately arranged in a concentric pattern, and
said protruding portions are placed in contact with said transparent member, and said recessed portions make no contact with said transparent member.

7 more elements

A method for manufacturing a solid-state imaging device, comprising:

forming a solid-state imaging element on a semiconductor substrate;
and
placing and fixing a transparent member on the solid-state imaging element,
wherein said forming the solid-state imaging element includes:
forming light receiving units on the semiconductor substrate;
and
forming digital microlenses each of which is arranged above an associated one of the light receiving units,
the digital microlens has protruding portions and recessed portions, each of the protruding portions and the recessed portions being alternately arranged in a concentric pattern, and
said placing and fixing the transparent member involves fixing the transparent member on the solid-state imaging element, so that the transparent member is placed in contact with the protruding portions, and the recessed portions make no contact with the transparent member.

6 more elements

Dependencies are inferred from the claim text.

Solid-state imaging device and manufacturing method thereof

Life of this patent

Solid-state imaging device and manufacturing method thereof

Life of this patent

Abstract

Claims10