Process Monitoring the Processing of a Material
AssigneeTRUMPF Werkzeugmaschinen GmbH + Co. KG
InventorsDieter Pfitzner, Tim Hesse, Winfried Magg
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Abstract
The invention relates to a method for monitoring a processing region of a workpiece (10) on which laser processing is being carried out, in which method the radiation emitted by the processing region (11) is detected by a detector system (22) in a space-resolved manner, wherein the radiation of the processing region (11) is detected for each elemental area of the processing region (11) imaged onto the detector system at least two wavelengths simultaneously. Accurate process monitoring may thereby be carried out.
Claims24
A method for monitoring a processing region of a workpiece on which laser processing is being carried out, the method comprising:
- detecting the radiation emitted by the processing region in a space-resolved manner, wherein the radiation of the processing region is detected for a plurality of elemental areas of the processing region at least two wavelengths simultaneously;
- and
- determining an emission coefficient from the detected radiation for each of the plurality of elemental areas.
(canceled)
(canceled)
7-9. (canceled)
The apparatus of claim 24, wherein the detector system includes at least one matrix camera.
The apparatus of claim 24, wherein the detector system includes a plurality of individual cameras.
The apparatus of claim 24, wherein the detector system comprises a plurality of photodiode arrays.
(canceled)
The apparatus of claim 24, further comprising at least one of optical fibers and imaging optics arranged in a beam path in front of the sensor elements.
The apparatus of claim 24, wherein the filter arrangement is one of integrated in a camera matrix of the detector system, arranged on a matrix surface positioned in front of the individual sensor elements, and provided between a beam splitter and the detector system.
The apparatus of claim 24, wherein the filter arrangement is integrated in a beam splitter mirror.
The apparatus of claim 24, wherein the filter arrangement comprises an arrangement of the optical filters in a chessboard pattern, a striped pattern or an arrangement of optical single filter elements.
21-22. (canceled)
An apparatus for monitoring laser processing of a workpiece, the apparatus comprising:
- a detector system with sensor elements for detecting radiation emitted from a plurality of elemental areas, wherein radiation emitted from one of the elemental areas is detected by at least two of the sensor elements;
- a filter arrangement with optical filters, wherein at least one of the optical filters is associated with at least one of the sensor elements, wherein optical filters associated with sensor elements detecting radiation emitted from the same elemental area filter the radiation at differing wavelengths;
- and
- an evaluation device for determining at least an emission coefficient for the plurality of elemental areas based on the detected radiation.
Dependencies are inferred from the claim text.