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AssigneeSemi Solutions, LLC
InventorsAshok Kumar KAPOOR, Robert Strain, Reuven Marko
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An apparatus and method of manufacture for metal-oxide semiconductor (MOS) transistors is disclosed. Devices in accordance with the invention are operable at voltages below 2V. The devices are area efficient, have improved drive strength, and have reduced leakage current. A dynamic threshold voltage control scheme comprised of a forward biased diode in parallel with a capacitor is used, implemented without changing the existing MOS technology process. This scheme controls the threshold voltage of each transistor. In the OFF state, the magnitude of the threshold voltage of the transistor increases, keeping the transistor leakage to a minimum. In the ON state, the magnitude of the threshold voltage decreases, resulting in increased drive strength. The invention is particularly useful in MOS technology for both bulk and silicon on insulator (SOI) CMOS. The use of reverse biasing of the well, in conjunction with the above construct to further decrease leakage in a MOS transistor, is also shown.
A method for reducing leakage current and increasing drive current in a metal-oxide semiconductor (MOS) transistor having a source terminal, a drain terminal, a gate terminal, and a well terminal, said method comprising the steps of:
A method for reducing leakage current and increasing drive current in a metal-oxide-semiconductor (MOS) transistor having a source terminal, a drain terminal, a gate terminal, and a well terminal, said method comprising the steps of:
A method for reducing leakage current and increasing drive current in a metal-oxide semiconductor (MOS) transistor having a source terminal, a drain terminal, a gate terminal, and a well terminal, said method comprising the steps of:
Dependencies are inferred from the claim text.