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US 2010/0134134 A1Published application
Test electronics to device under test interfaces, and methods and apparatus using same
AssigneeVerigy (Singapore) Pte. Ltd.
InventorsSanjeev Grover, Donald W. Chiu, John W. Andberg
Life of this patent
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Abstract
In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.
Claims20
Apparatus, comprising:
- at least one test electronics to device under test (DUT) interface, each test electronics to DUT interface having:
- a test electronics interface having:
- first and second printed circuit boards (PCBs);
- and
- first and second test electronics interposers, each test electronics interposer having a first side and a second side, the first side of each test electronics interposer having a first plurality of electrical contacts that is electrically coupled to a respective one of the PCBs, and the second side of each test electronics interposer having a second plurality of electrical contacts coupled to the first plurality of electrical contacts, the second plurality of electrical contacts providing an electrical coupling to a test electronics assembly;
- a DUT interface having:
- a flex circuit having i) a plurality of electrical contacts on a surface thereof, and ii) a plurality of electrical signal paths coupled to the plurality of electrical contacts;
- and
- a DUT interposer having a first side and a second side, the first side of the DUT interposer having a first plurality of electrical contacts coupled to the plurality of electrical contacts of the flex circuit, and the second side of the DUT interposer having a second plurality of electrical contacts coupled to the first plurality of electrical contacts, the second plurality of electrical contacts providing an electrical coupling to a DUT;
- and
- a plurality of coaxial cables coupled between the first and second PCBs of the test electronics interface and the electrical signal paths of the flex circuit, the plurality of coaxial cables being electrically coupled to the test electronics interposers via the first and second PCBs.
8 more elements
A test electronics to device under test (DUT) interface, comprising:
- a test electronics interface;
- a zero insertion force (ZIF) connector having:
- a compliant flex circuit form;
- a flex circuit having a first surface and a second surface, the flex circuit being looped around the flex circuit form with the first surface facing the flex circuit form, the flex circuit having a plurality of electrical contacts on the second surface, the plurality of electrical contacts providing at least part of a DUT interface, and the flex circuit having a plurality of electrical signal paths thereon, the plurality of electrical signal paths being coupled to the plurality of electrical contacts of the DUT interface;
- and
- a ZIF connector to DUT clamping mechanism;
- and
- a plurality of coaxial cables coupled between the test electronics interface and the electrical signal paths of the flex circuit.
5 more elements
An interface, comprising:
- a plurality of test electronics to DUT interfaces, each test electronics to DUT interface having at least one test electronics interface, at least one DUT interface, and an electrical coupling between the at least one test electronics interface and the at least one DUT interface;
- wherein first and second subsets of the DUT interfaces are respectively positioned along the perimeters of first and second concentric shapes.
In a test system having a set of test electronics for testing a device under test (DUT), the improvement comprising:
- at least one test electronics to DUT interface having a zero insertion force (ZIF) connector, the ZIF connector having a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.
A method of coupling a test electronics to DUT interface between a test electronics assembly and a probe card, comprising:
- providing a test electronics to DUT interface comprising a test electronics interface that is electrically coupled to a DUT interface;
- coupling the test electronics interface to a test electronics assembly;
- and
- coupling the DUT interface to a probe card that interfaces with a DUT, by causing a ZIF connector to DUT clamping mechanism of the DUT interface to pull on one or more features of the probe card, the pulling exerting at least one force that is directed orthogonally away from the probe card, and the coupling of the DUT interface to the probe card applying an orthogonal force toward the probe card, wherein the orthogonal forces offset one another.
1 more element
A method of configuring a plurality of test systems, comprising:
- providing test electronics assemblies having ZIF connectors mounted thereon, the test electronics assemblies including i) a first type of test electronics assembly having ZIF connectors mounted thereon in first positions, and ii) a second type of test electronics assembly having ZIF connectors mounted thereon in second positions, the second positions differing from the first positions;
- configuring a first test system by installing a plurality of the first type of test electronics assembly, but none of the second type of test electronics assembly, in the first test system, wherein installing only the first type of test electronics assembly in the first test system positions the ZIF connectors of the first type of test electronics assembly along a perimeter of a first shape;
- and
- configuring a second test system by installing a plurality of the first type of test electronics assembly and a plurality of the second type of test electronics assembly in the second test system, wherein installing both the first type of test electronics assembly and the second type of test electronics assembly in the second test system positions the ZIF connectors of the first type of test electronics assembly along a perimeter of a first shape and positions the ZIF connectors of the second type of test electronics assembly along a perimeter of a second shape.
1 more element
Dependencies are inferred from the claim text.