Electrochemically Fabricated Microprobes
AssigneeMicrofabrica Inc.
InventorsRichard T. Chen, Ezekiel J.J. Kruglick, Christopher A. Bang, Vacit Arat, Adam L. Cohen, Kieun Kim, Gang Zhang, Dennis R. Smalley
Life of this patent
Estimating the term…
Abstract
Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
Claims15
A probe device for testing semiconductor die, comprising:
- a substrate having a surface defining a plane of the substrate;
- a multi-turn compliant helical conductive element comprising:
- an intermediate portion having a helical configuration that has an axis that extends perpendicular to the plane of the substrate;
- a proximal end attached directly or indirectly to the substrate and which joins the intermediate portion;
- and
- a distal end that extends perpendicular to the plane of the substrate and defines a surface that is used to contact a pad of the semiconductor device to be tested and which connects directly or indirectly to the intermediate portion.
A probe device for testing semiconductor die, comprising:
- a substrate;
- a multi-turn compliant, conical helical conductive element adhered directly or indirectly to the substrate and extending substantially perpendicular to the substrate along a winding path of progressively narrowing radius, where a distal end of the probe is substantially located at a point along an axis of helix and may be used to contact a pad to be tested.
A probe device for testing semiconductor die, comprising:
- a substrate having a face defining a plane of the substrate;
- and
- a multi-turn helical spiral conductive element, comprising:
- an intermediate portion extending substantially perpendicular to the substrate along a spiraling path where a plurality of successive stair steps define the spiraling path such that at least some stair steps provide a pattern of structural material that only partially overlays a pattern of structural material on a succeeding stair step and on a previous stair step;
- a proximal end adhered directly or indirectly to the substrate and which joins the intermediate portion;
- and
- a distal end that extends defining a surface that is used to contact a pad of the semiconductor device to be tested and which connects directly or indirectly to the intermediate portion.
A plurality of separate probes for testing semiconductor die, comprising:
- a substrate;
- a plurality of multi-turn helical conductive elements, each comprising:
- an intermediate portion having a helical configuration that has an axis that extends perpendicular to the plane of the substrate wherein a plurality of successive stair steps define the intermediate portion such that at least some stair steps provide a pattern of structural material that only partially overlays a pattern of structural material on a succeeding stair step and on a previous stair step;
- a proximal end attached directly or indirectly to the substrate and which joins the intermediate portion, and
- a distal end that is used to contact a pad to be tested and which connects directly or indirectly to the intermediate portion
- wherein a spacing between stair stepped portions of adjacent probes on a same plane that is parallel to the plane of the substrate adjacent is greater than a lateral spacing between adjacent probes when taken as a whole.
Dependencies are inferred from the claim text.