Mechanical decoupling of a probe card assembly to improve thermal response
AssigneeFormFactor, Inc.
InventorsKeith J. Breinlinger, Eric D. Hobbs
Life of this patent
Estimating the term…
Abstract
A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
Claims33
A probe card assembly for testing electronic devices comprising:
- a stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack, wherein the wiring substrate is disposed between the frame and the stiffener structure;
- a plurality of probe substrates each having probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller;
- and
- one or more non-adjustably fixed coupling mechanisms, each non-adjustably fixed coupling mechanism fixing one or more of the probe substrates to the frame, the non-adjustably fixed coupling mechanisms being simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
A process of testing semiconductor dies, the process comprising:
- coupling a probe card assembly to a test system, the probe card assembly comprising a frame coupled to a stiffener structure, a wiring substrate disposed between the stiffener structure and the frame, and a plurality of probe substrates coupled to a major surface of the frame;
- electrically connecting an electrical interface on the wiring substrate to a test controller configured to control testing of the dies, the electrical interface electrically connected through the probe card assembly to probes coupled to the probe substrates;
- effecting contact between tips of ones of the probes and terminals of the dies;
- while maintaining the contact, providing test signals between the test controller and the dies through the probe card assembly;
- and
- while providing the test signals, impeding relative movement between the frame and each of the probe substrates in a first direction perpendicular to the major surface of the frame and simultaneously allowing relative movement between the frame and each of the probe substrates in a second direction generally parallel to the major surface of the frame.
A process of making a probe card assembly, the process comprising:
- obtaining a stack comprising a stiffener structure, a frame coupled to the stiffener structure, and a wiring substrate between the stiffener structure and the frame and coupled to the frame;
- and
- coupling a plurality of probe substrates to the frame with non-adjustably fixed coupling mechanisms that are simultaneously stiff in a first direction that is perpendicular to the stack and flexible in second directions that are parallel to the stack,
- wherein probes coupled to the probe substrates are electrically connected through the frame and wiring substrate to an electrical interface on the wiring substrate to a test controller.
33-64. (canceled)
Dependencies are inferred from the claim text.