Probe and method for manufacturing the same
AssigneesM2N Inc., Secron Co., Ltd.
InventorsKi-Pil Hong, Jong-Hyeon Chae, Hac-Ju Lee, Young-Gun Park
Life of this patent
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Abstract
A probe for making electric contact with a contact target includes a first part (10) including a first base portion (15) and a socket portion (17) formed on the first base portion; and a second part including (20) a second base portion (25) and a plug portion (21) formed on the second base portion. And the plug portion is removably coupled to the socket portion.
Claims36
A probe for making electric contact with a contact target, comprising:
- a first part including a first base portion and a socket portion formed on the first base portion;
- and
- a second part including a second base portion and a plug portion formed on the second base portion,
- wherein the plug portion is removably coupled to the socket portion.
A method for manufacturing a probe, comprising the steps of:
- forming a conductive layer on a semiconductor substrate;
- forming on the conductive layer a pattern layer in which a first group of openings, each being formed in a shape of a first part having a socket portion, and a second group of openings, each being formed in a shape of a second part having a plug portion, are formed, the first group of openings being connected to a first tree opening, the second group of openings being connected to a second tree opening;
- forming a probe structure on an upper surface of the conductive layer exposed through the pattern layer by performing a plating process;
- and
- removing the pattern layer, the semiconductor substrate and the conductive layer.
A method for manufacturing a probe, comprising the steps of:
- forming a conductive layer on a semiconductor substrate;
- forming on the conductive layer a pattern layer which has a first group of patterns, each being formed in a shape of a first part having a socket portion, and a second group of patterns, each being formed in a shape of a second part having a plug portion, the first group of patterns being connected to a first tree patterns, the second group of patterns being connected to a second tree pattern;
- forming a probe structure by patterning the conductive layer covered by the pattern layer;
- and
- removing the pattern layer and the semiconductor substrate,
- wherein the pattern layer serves as an etch mask when the conductive layer is patterned.
A method for manufacturing a contact module, comprising the steps of:
- inserting a first part of a probe, having a first base portion, a socket portion formed on the first base portion, and a second part of the probe, having a second base portion, a plug portion formed on the second base portion and a connection pin formed on the second base portion, into an upper and a lower portion of a contact hole of a contact substrate, respectively so that the first part is removably coupled to the second part;
- and
- mounting a through hole space transformer on the connection pin of the probe.
Dependencies are inferred from the claim text.