Multicolor package
AssigneeEpistar Corporation
InventorChia-Liang HSU
Life of this patent
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Abstract
An opto-electronic device package structure for multicolor light is disclosed. The package structure comprises a transparent carrier, a circuit layer on the transparent carrier, an opto-electronic device emitting the light of the first wavelength and is electrically connecting with the circuit layer on the transparent carrier, a first wavelength conversion structure on the lateral side of the opto-electronic device, a reflective layer on the first wavelength conversion structure, and a transparent material for package on the reflective layer and on the opto-electronic device.
Claims13
An opto-electronic device package structure emitting multicolor light, comprising:
- a transparent carrier having a first surface and a second surface;
- a circuit layer on the first surface of the transparent carrier;
- an opto-electronic device emitting the light of the first wavelength and is electrically connecting with the circuit layer on the transparent carrier;
- a first wavelength conversion structure on the lateral side of the opto-electronic device, wherein the first wavelength conversion structure converting the light of the first wavelength emitting from the lateral side of the opto-electronic device into light of the second wavelength;
- a reflective layer on the first wavelength conversion structure, wherein the light of the second wavelength is reflected to the first wavelength conversion structure by the reflective layer and emitted from the second surface of the transparent carrier;
- and
- a transparent material for package on the reflective layer and on the opto-electronic device for the light of the first wavelength passing through the transparent material for package.
An opto-electronic device package structure emitting multicolor light, comprising:
- a transparent carrier having a first surface and a second surface;
- a circuit layer on the first surface of the transparent carrier;
- an opto-electronic device emitting the light of the first wavelength and is electrically connecting with the circuit layer on the transparent carrier;
- a first wavelength conversion structure on the lateral side of the opto-electronic device, wherein the first wavelength conversion structure converting the light of the first wavelength emitting from the lateral side of the opto-electronic device into light of the second wavelength;
- a reflective layer on the first wavelength conversion structure, wherein the light of the second wavelength is reflected to the first wavelength conversion structure by the reflective layer and emitted from the second surface of the transparent carrier;
- a second wavelength conversion structure on the reflective layer and on the opto-electronic device, wherein the light of the first wavelength emitting from the opto-electronic device is converted into the light of the third wavelength by the second wavelength conversion structure;
- and
- a transparent material for package on the second wavelength conversion structure for the light of the third wavelength passing through the transparent material for package.
Dependencies are inferred from the claim text.