Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination
AssigneeLintec Corporation
InventorsYasunori Karasawa, Isao Ichikawa
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Abstract
A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.
Claims18
A semiconductor chip laminate comprising:
- a plurality of semiconductor chips;
- and
- an adhesive layer through which the plurality of semiconductor chips are laminated,
- wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A);
- an epoxy resin (B);
- a thermal curing agent (C);
- and an organic phosphine compound (D) represented by Formula (I) below as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight:
- wherein R1 to R4 are functional groups independently selected from the group consisting of alkyl groups having 1 to 18 carbon atoms, aryl groups having 6 to 15 carbon atoms, and arylalkyl groups having 7 to 16 carbon atoms;
- and Y− represents an organic anion.
An adhesive composition for semiconductor chip lamination comprising:
- an acrylic polymer (A);
- an epoxy resin (B);
- a thermal curing agent (C);
- and
- an organic phosphine compound (D) represented by Formula (I) below as a thermal curing accelerator,
- wherein the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight:
- wherein R1 to R4 are functional groups independently selected from the group consisting of alkyl groups having 1 to 18 carbon atoms, aryl groups having 6 to 15 carbon atoms, and arylalkyl groups having 7 to 16 carbon atoms;
- and Y− represents an organic anion.
Dependencies are inferred from the claim text.