Metal interconnect and ic chip including metal interconnect

An integrated circuit (IC) chip comprising:

• a middle-of-the-line (MOL) layer including a high dielectric constant (high-k) dielectric;
• a first metal layer above the MOL layer, the first metal layer including a low dielectric constant (low-k) dielectric;
• and
• a plurality of metal interconnects, each of the plurality of metal interconnects including:
• a contact having a first portion in the high-k dielectric of the MOL layer and a second portion in the low-k dielectric of the first metal layer, and
• a wire coupled to the contact and positioned in the low-k dielectric of the first metal layer,
• wherein the low-k dielectric of the first metal layer extends beyond a lower surface of a liner layer of the wire of each of the plurality of metal interconnects, and wherein a portion of the low-k dielectric of the first metal layer is positioned between the high-k dielectric and the wire of each of the plurality of metal interconnects.

An integrated circuit (IC) chip comprising:

• a middle-of-the-line (MOL) layer including a high dielectric constant (high-k) dielectric, wherein the high-k dielectric includes a silicon dioxide (SiO2);
• a first metal layer above the MOL layer, the first metal layer including a low dielectric constant (low-k) dielectric, wherein the low-k dielectric is selected from the group consisting of:
• a spin-on polymer, vapor deposited SiLK™, vapor deposited hydrogenated silicon oxycarbide (SiCOH) and organosilicates;
• and
• a metal interconnect including:
• a contact having a first portion in the high-k dielectric of the MOL layer and a second portion in the low-k dielectric of the first metal layer, and
• a wire coupled to the contact and positioned in the low-k dielectric of the first metal layer,
• wherein the low-k dielectric of the first metal layer extends beyond a lower surface of a liner layer of the wire, and wherein a portion of the low-k dielectric of the first metal layer is positioned between the high-k dielectric and the wire of each of the plurality of metal interconnects.