Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads

A semiconductor device, comprising:

• a substrate;
• an input/output (I/O) pad formed over the substrate;
• a first insulating layer formed over the substrate and I/O pad;
• a redistribution layer formed over the I/O pad and first insulating layer;
• a second insulating layer formed over the first insulating layer, I/O pad, and redistribution layer, the second insulating layer having a sidewall between a surface of the second insulating material and a surface of the redistribution layer;
• a protective layer formed over the second insulating layer and redistribution layer, the protective layer following a contour of the surface and sidewall of the second insulating layer and surface of the redistribution layer;
• and
• a bump formed over the surface of the redistribution layer and a portion of the protective layer adjacent to the sidewall of the second insulating layer, wherein the protective layer over the sidewall of the second insulating layer protects the second insulating layer.

A semiconductor device, comprising:

• a substrate;
• a first conductive layer formed over the substrate;
• a first insulating layer formed over the substrate and first conductive layer;
• a second conductive layer formed over the first conductive layer and first insulating layer;
• a second insulating layer formed over the first insulating layer and second conductive layer, the second insulating layer having a sidewall between a surface of the second insulating material and a surface of the second conductive layer;
• a protective layer formed over the surface of the second conductive layer and sidewall of the second insulating layer;
• and
• a bump is formed over the surface of the second conductive layer and a portion of the protective layer adjacent to the sidewall of the second insulating layer, wherein the protective layer over the sidewall of the second insulating layer protects the second insulating layer.

A semiconductor device, comprising:

• a substrate;
• a first conductive layer formed over the substrate;
• a first insulating layer formed over the substrate and first conductive layer;
• a second conductive layer formed over the first conductive layer and first insulating layer;
• a second insulating layer formed over the first insulating layer and second conductive layer;
• a protective layer formed over the surface of the second conductive layer and second insulating layer;
• and
• a bump is formed over the surface of the second conductive layer.