System and apparatus for venting electronic packages and method of making same
AssigneeGeneral Electric Company
InventorsRaymond Albert Fillion, Kevin M. Durocher, Elizabeth A. Burke, Thomas Bert Gorczyca, Charles G. Woychik
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Abstract
An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.
Claims22
An apparatus comprising:
- a substrate configured to support a plurality of dielectric layers;
- a device coupling area positioned in the substrate, wherein the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers;
- and
- a plurality of gas exit apertures formed through the substrate, wherein each of the plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material therethrough.
An electronic device package comprising:
- at least one interconnection layer;
- at least one electronic device element coupled to the at least one interconnection layer;
- a stiffener coupled to the at least one interconnection layer and comprising a substrate comprising:
- at least one device area formed in the substrate and configured to receive the at least one electronic device element therein;
- and
- a plurality of vent apertures extending through the substrate, the plurality of vent apertures configured to facilitate the exit of at least one of a gaseous material and a moisture;
- and
- a pattern of electrical conductors formed in the at least one interconnection layer and configured to electrically connect the at least one interconnection layer to the at least one electronic device element.
A method of forming an electronic device package comprising:
- providing a package stiffener having a die area configured to receive a die and having a plurality of vent apertures formed therein, wherein the plurality of vent apertures is configured to provide an exit passage for at least one of moisture and materials outgassed from a plurality of electronic package layers;
- attaching the plurality of electronic package layers to the package stiffener;
- attaching the die to the plurality of electronic package layers;
- and
- forming electrically conductive paths in the plurality of electronic package layers.
Dependencies are inferred from the claim text.