Semiconductor chip stacked body and method of manufacturing the same

A method of manufacturing a semiconductor chip stacked body having a plurality of chip sealing bodies which are stacked and conductively connected mutually, and a wiring substrate which mounts the plurality of chip sealing bodies thereon, each of the chip sealing body including a semiconductor chip having a semiconductor integrated circuit, a pad and a conductive connecting material, and a resin sealing the semiconductor chip, the method comprising:

• a step of dicing a semiconductor wafer, which has semiconductor integrated circuits and pads, by using a dicing tape, into individual pieces to form the plurality of semiconductor chips;
• a step of forming a plurality of chip sealing bodies by connecting the pads of the semiconductor chips obtained by the dicing step to each other by the conductive connecting material respectively on the dicing tape, sealing the semiconductor chips with the resin, peeling the dicing tape, sealing portions of the semiconductor chips exposed by the peeling with the resin, and then dicing a resultant structure into individual pieces;
• a step of forming a chip stacked body by stacking the plurality of chip sealing bodies, and then connecting conductively end portions of the conductive connecting materials, which are exposed from surfaces of the plurality of chip sealing bodies, by a conductive bonding wire mutually;
• and
• a step of mounting the chip stacked body on the wiring substrate, and then connecting the chip stacked body and the wiring substrate via a wiring.

A method of manufacturing a semiconductor chip stacked body having a plurality of chip sealing bodies which are stacked and conductively connected mutually, and a wiring substrate which mounts the plurality of chip sealing bodies thereon, each of the chip sealing body including a semiconductor chip having a semiconductor integrated circuit, a pad and a conductive connecting material, a die attach film with a resin sealing function, and a sealing resin, the die attach film and the sealing resin sealing the semiconductor chip, the method comprising:

• a step of dicing a semiconductor wafer, which has semiconductor integrated circuits and pads, by using a dicing tape, into individual pieces to form the plurality of semiconductor chips;
• a step of forming a plurality of chip sealing bodies by mounting the semiconductor chips obtained by the dicing step in predetermined positions on the die attach film, connecting the pads to each other by the conductive connecting material respectively, sealing the semiconductor chips and the conductive connecting materials located higher the die attach film with the sealing resin, and then dicing a resultant structure into individual pieces;
• a step of forming a chip stacked body by stacking the plurality of chip sealing bodies, and then connecting conductively end portions of conductive connecting materials, which are exposed from surfaces of the plurality of chip sealing bodies, by a conductive bonding wire mutually;
• and
• a step of mounting the chip stacked body on the wiring substrate, and then connecting the chip stacked body and the wiring substrate via a wiring.