Dual-sided substate integrated circuit package including a leadframe having leads with increased thickness

A lead frame adapted for use within an integrated circuit package of the type including:

• a first non-conductive substrate having a first inner surface,
• at least one first contact pad disposed on said first inner surface for selective electrical communication with circuit elements through conductors carried by said first substrate,
• a second non-conductive substrate having a second inner surface,
• at least one second contact pad disposed on said second inner surface for selective electrical communication with circuit elements through conductors carried by said second substrate, wherein said first and second contact pads are opposed from one another, and
• a die disposed between said first and second inner surfaces, said die having a first thickness,
• said lead frame comprising:
• a body portion;
• and
• a plurality of members extending from said body portion, each said member having a proximal end and a distal end, said proximal end having a first thickness, said distal end being undulated such that said distal end has an effective thickness greater than said first thickness.

A method of manufacturing a lead frame, comprising the steps of:

• forming a body portion;
• and
• forming a plurality of members extending from said body portion, each of said members defining a proximal end and a distal end, with each of said proximal ends having a first thickness, and
• forming an undulation in each of said distal ends, whereby each said distal end has an effective thickness greater than said first thickness,
• wherein each distal end defines opposed surfaces for simultaneously bridging facing contact surfaces which are separated by a dimension greater than said first thickness.