Flip-chip package structure and the die attach method thereof
OwnerChung Hsing Tzuinventor
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Abstract
A flip-chip package structure comprises a carrier, a block bump, and a die. The carrier is a lead frame or substrate that comprises a lead pattern side, and an electrode pin is disposed on the lead pattern side. The die comprises an active side, and a bond pad is disposed on the active side. The block bump is bonded to the electrode pin; the bond pad of the die is attached on the carrier through the block bump, so that the die and the carrier joint together to form the flip chip package structure. Besides, the block bump is formed by the wedge bonding, and therefore in bumping size and shapes can easily form larger bump, which will increase the compactness between the die and the carrier.
Claims18
A flip chip package structure, comprising:
- a carrier;
- a block bump formed on said carrier;
- and
- a die with a bond pad disposed thereon, wherein said bond pad of said die is bonded to said block bump of said carrier.
A flip chip package structure, comprising:
- a carrier comprising a lead pattern side, and a first electrode pin and a second electrode pin disposed on said lead pattern side;
- a first block bump and a second block bump respectively bonded to said first electrode pin and said second electrode pin by ultrasonic bonding or wedge bonding such that metal diffusion is happened between the block bumps and the electrode pins;
- and
- a die comprising an active side and a backside, and a first bond pad and a second bond pad disposed on said active side;
- wherein said first bond pad and said second bond pad of said die are respectively bonded to said first block bump and said second block bump of said carrier.
A die attach method of a flip chip package structure, comprising:
- providing a carrier with a electrode and a die with a bond pad;
- forming said block bump on said electrode;
- and
- bonding said bond pad of said die to said block bump such that said die is attached to said carrier.
Dependencies are inferred from the claim text.