Power semiconductor module
AssigneeMitsubishi Electric Corporation
InventorsSeiji OKA, Yoshiko OBIRAKI, Takeshi OI
Life of this patent
Estimating the term…
Abstract
A wiring process between the provided power semiconductor module and the external circuit is simple. In the power semiconductor module, a power semiconductor element and a cylindrical conductor are joined to one surface of a lead frame. An opening of the cylindrical conductor is exposed at a surface of transfer molding resin. Sealing with the transfer molding resin is performed such that terminal portions of the lead frame protrude from peripheral side portions of the transfer molding resin. The cylindrical conductor is conductive with a control circuit. The terminal portions of the lead frame are each conductive with a main circuit.
Claims9
A power semiconductor module comprising:
- a lead frame;
- a power semiconductor element;
- and
- a cylindrical conductor,
- a part of the lead frame, the power semiconductor element, and the cylindrical conductor, all being sealed with transfer molding resin, wherein
- terminal portions of the lead frame protrude from peripheral side portions of the power semiconductor module, and
- an opening of the cylindrical conductor is exposed at a top surface of the power semiconductor module.
Dependencies are inferred from the claim text.