Integrated circuit packaging system with lead frame and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsJong-Woo Ha, TaeWoo Kang, DongSoo Moon
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; and removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- attaching a base device over the base substrate;
- attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate;
- applying a base encapsulant over the base device, the base substrate, and the leadframe;
- and
- removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate having a base top side;
- attaching a base device over the base top side;
- attaching a leadframe having a leadframe pillar adjacent the base device over the base top side;
- applying a base encapsulant over the base device, the base top side, and the leadframe;
- and
- removing a portion of the base encapsulant and a portion of the leadframe providing a top of the leadframe pillar substantially exposed.
An integrated circuit packaging system comprising:
- a base substrate;
- a base device over the base substrate;
- a leadframe pillar, having characteristics of a portion of a leadframe being removed, adjacent the base device over the base substrate;
- and
- a base encapsulant over the base device, the base substrate, and the leadframe pillar partially exposed.
Dependencies are inferred from the claim text.