Differential-pressure sensor system and corresponding production method
OwnerHubert BENZELinventor
Life of this patent
Estimating the term…
Abstract
A differential-pressure sensor system and a corresponding production method. The differential-pressure sensor system includes: a differential-pressure sensor chip having a first pressure application region for applying a first pressure, as pressure to be detected, to the differential-pressure sensor chip, and a second pressure application region for applying a second pressure, as reference pressure, to the differential-pressure sensor chip; a housing that partially surrounds the differential-pressure sensor chip; the housing having a through hole, through which the first pressure application region is exposed to the outside; and the housing having an input opening, through which the second pressure application region is exposed to the outside.
Claims14
1-13. (canceled)
A differential-pressure sensor system, comprising:
- a differential-pressure sensor chip, which has a first pressure application region for applying a first pressure to the differential-pressure sensor chip as pressure to be detected, and a second pressure application region for applying a second pressure to the differential-pressure sensor chip as reference pressure, the first and the second pressure application region being connected by a connection channel region;
- and
- a housing which partially surrounds the differential-pressure sensor chip, the housing having a through hole, through which the first pressure application region is exposed to the outside, and an input opening through which the second pressure application region is exposed to the outside.
A method for producing a differential-pressure sensor system, comprising:
- producing a housing by injection molding a differential-pressure sensor chip using an injection-molding substance, the pressure differential chip having a first pressure application region for applying a first pressure to the differential-pressure sensor chip as pressure to be detected, and a second pressure application region for applying a second pressure to the differential-pressure sensor chip as reference pressure, the first and second pressure application region being connected to a connection channel region, the housing partially surrounding the differential-pressure sensor chip and having a through hole through which the first pressure application region is exposed to the outside, and an input opening through which the second pressure application region is exposed to the outside, the input opening and the through hole being formed by corresponding place holders during extrusion coating.
Dependencies are inferred from the claim text.