Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
AssigneeHoneywell International Inc.
InventorsWENWEI ZHANG, LEN MUSLEK, JAMIE BOYD, MARK NESBITT, MARTYN DALZIEL
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.
Claims19
An integrated circuit (IC) device, comprising:
- a lead frame comprising a die pad and a plurality of lead fingers having a first and a second opposing surface;
- a first die comprising a signal processor mounted on said first surface of said die pad, and
- a second die mounted on said second surface of said die pad, wherein said second die comprises at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal,
- wherein said sensor output is coupled to said signal processor, and wherein said first die processes said sensing signal.
A method of fabricating an integrated circuit (IC) device, comprising:
- providing a lead frame comprising a die pad and a plurality of lead fingers having a first and a second opposing surface;
- attaching a first die comprising a signal processor to said first surface of said lead frame;
- and
- attaching a second die including at least one sensor to said second surface of said lead frame, wherein said sensor has at least one sensor output that senses at least one non-electrical parameter and provides a sensing signal for said parameter,
- wherein said first die is coupled to said signal processor to receive and process said sensing signal.
Dependencies are inferred from the claim text.