Light emitting diode package structure and conductive structure and manufacturing method thereof
AssigneeEverlight Electronics Co., Ltd.
InventorKe-Hao Pan
Life of this patent
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Abstract
A light emitting diode package structure includes a frame, a light emitting diode chip electrically coupled to the frame, an upper packing portion covering the light emitting diode chip on the frame, and a lower packing portion circumferentially disposed on the frame for fixation and next to the upper packing portion. Lights from the light emitting diode chip are outwardly emitted through the upper packing portion. The lower packing portion is extended from and partially covered by the upper packing portion.
Claims30
A light emitting diode package structure, comprising:
- a frame;
- a light emitting diode chip electrically coupled to the frame;
- an upper packing portion covering the light emitting diode chip on the frame, wherein light radiated from the light emitting diode chip is outwardly emitted through the upper packing portion;
- and
- a lower packing portion circumferentially disposed on the frame and disposed next to the upper packing portion to secure the frame, wherein the lower packing portion is extended from and partially covered by the upper packing portion.
A conductive structure for dissipating heat generated from a light emitting diode chip, comprising:
- an upper packing portion covering the light emitting diode chip;
- and
- a lower packing portion disposed next to the upper packing portion, wherein the light emitting diode chip is electrically coupled to a frame, such that the heat generated from the light emitting diode chip is transferred to the lower packing portion via the frame.
A method for manufacturing a light emitting diode package structure, comprising the steps of:
- providing a frame comprising a first leg and a second leg;
- providing a light emitting diode chip to dispose on the first leg of the frame and electrically couple to the second leg of the frame;
- utilizing a first heat-dissipative unit to cover and secure the first and second legs of the frame;
- and
- utilizing an anti-fading unit to cover the light emitting diode chip on the frame and to partially cover the first heat-dissipative unit, such that light emitting from the light emitting diode chip is outwardly radiated via the anti-fading unit, and heat generated from the light emitting diode chip is transferred to the first heat-dissipative unit via the anti-fading unit.
A light emitting diode package structure, comprising:
- a frame;
- a light emitting diode chip electrically coupled to the frame;
- a lower packing portion disposed on the frame, comprising a body and at least one extension connected to the body;
- and
- an upper packing portion covering the light emitting diode chip, to fully cover the body of the lower packing portion, and to partially cover the at least one extension of the lower packing portion.
Dependencies are inferred from the claim text.