Method for Producing Semiconductor Components and Thin-Film Semiconductor Component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsSiegfried Herrmann, Berthold Hahn
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Abstract
The invention relates to a method for producing semiconductor components, wherein a layer composite (6) containing a semiconductor material is formed on a growth substrate (1), a flexible carrier layer is applied to the layer composite (6), the flexible carrier layer is cured to form a self-supporting carrier layer (2), and the growth substrate (1) is stripped away. As an alternative, the carrier layer (2) may have a base layer (2b) and an adhesion layer (2a) adhering on the layer composite.
Claims78
A method for producing semiconductor components, comprising the steps of:
- forming a layer composite containing a semiconductor material on a growth substrate;
- applying a flexible carrier layer to the layer composite;
- curing the flexible layer to form a self-supporting carrier layer;
- and
- stripping away the growth substrate.
A method for producing semiconductor components, comprising the steps of:
- forming a layer composite containing a semiconductor material on a growth substrate;
- applying a self-supporting carrier layer to the layer composite, wherein the carrier layer has a base layer and an adhesion layer, which faces the layer composite and which adheres on the layer composite;
- and
- stripping away the growth substrate.
A thin-film semiconductor component comprising:
- a layer stack;
- and
- a self-supporting carrier layer arranged on the layer stack,
- wherein the carrier layer is cured.
A thin-film semiconductor component comprising:
- a layer stack;
- a self-supporting carrier layer arranged on the layer stack, wherein
- the carrier layer has a base layer and an adhesion layer, which faces the layer stack and which adheres on the layer stack.
Dependencies are inferred from the claim text.