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US 2010/0133558 A1Published application
Flip chip type led lighting device manufacturing method
AssigneeNeobulb Technologies, Inc.
InventorsJEFFREY CHEN, CHUNG ZEN LIN
Life of this patent
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Abstract
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices.
Claims10
A LED lighting device comprising:
- a submount with a plurality of light emitting diodes installed thereon;
- a strip element adhesive to the submount, wherein the strip element defines a hole therein and the area of the submount is bigger than the area of the hole of the strip element, and wherein the light emitting diodes are surrounding by the peripheral of the hole of the strip element;
- and
- a heat conducting member, wherein the strip element is affixed to the heat conducting member and the submount is thermally coupled to the heat conducting member.
1 more element
A LED lighting device comprising;
- a submount;
- a plurality of light emitting diodes installed on the submount;
- a strip element overlying on the submount, the strip element defining a hole therein and comprising electrical circuits, wherein the area of the submount is bigger than the area of the hole of the strip element and the light emitting diodes are surrounding by the peripheral of the hole;
- and
- a heat conducting member;
- wherein the strip element is affixed to the heat conducting member, and the light emitting diodes is electrically coupled to the electrical circuits of the strip element.
3 more elements
Dependencies are inferred from the claim text.