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US 2010/0133535 A1Published application
Semiconductor device with reduced pad pitch
AssigneeNEC Electronics Corporation
InventorTsukasa OJIRO
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Abstract
A semiconductor device includes a first pad, a second pad and a third pad. The first pad and the third pad are electrically connected to each other. The first pad and the second pad are used for bonding. The second pad and the third pad are used for probing. According to this structure, Small size semiconductor device having high reliability even after a probing test can be provided.
Claims4
A semiconductor device comprising:
- a first pad arranged on a semiconductor chip and designed to be used for bonding;
- a second pad arranged on the semiconductor chip and designed to be used for both bonding and probing:
- and
- a third pad arranged on the semiconductor chip and electrically connected to the first pad and designed to be used for probing,
- wherein the second pad is arranged to a longer direction of the second pad being directed to be parallel to a moving direction of a probe in probing the second pad, and
- the third pad is arranged to a longer direction of the third pad being directed to be parallel to a moving direction of the probe in probing the third pad.
3 more elements
Dependencies are inferred from the claim text.