Integrated circuit packaging system with interposer and flip chip and method of manufacture thereof
OwnerByung Tai Do, Reza Argenty Pagaila +1inventors
InventorsByung Tai Do, Reza Argenty Pagaila, Linda Pei Ee Chua
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having a first side and a second side with the first side having a device contact and an interconnect contact and with the second side having a test pad; mounting an integrated circuit over the device contact; and applying an underfill between the integrated circuit and the interposer.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing an interposer having a first side and a second side with the first side having a device contact and an interconnect contact and with the second side having a test pad;
- mounting an integrated circuit over the device contact;
- and
- applying an underfill between the integrated circuit and the interposer.
A method of manufacture of an integrated circuit packaging system comprising:
- providing an interposer having a first side and a second side including:
- providing the first side having a device contact and an interconnect contact with the device contact at an interior portion of the first side and the interconnect contact at a peripheral portion of the first side, and
- providing the second side having a test pad;
- mounting an integrated circuit over the device contact;
- and
- applying an underfill between the integrated circuit and the interposer without covering the interconnect contact.
An integrated circuit packaging system comprising:
- an interposer having a first side and a second side with the first side having a device contact and an interconnect contact and with the second side having a test pad;
- an integrated circuit over the device contact;
- and
- an underfill between the integrated circuit and the interposer.
Dependencies are inferred from the claim text.