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US 2010/0133484 A1Published application
Paste Composition for Forming Heat-Resistant Conductive Patterns on Substrate
AssigneeExax Inc.
InventorsSoon Yeong Heo, Seong Sil Park
Life of this patent
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Abstract
A paste composition for forming heat-resistant and electrically conductive patterns on substrate by direct printing includes conductive particles, polyamic acid, and solvent. The paste composition can form solderable electric circuits or solderable antenna on substrate, especially on flexible sheets by direct printing to simplify processes, to save time and cost, and to minimize waste.
Claims9
A paste composition for forming heat-resistant and electrically conductive patterns by direct printing comprising:
- conductive particles;
- polyamic acid;
- and
- solvent.
1 more element
Dependencies are inferred from the claim text.