Electronic element wafer module and method for manufacturing same, electronic element module, optical element wafer module and method for manufacturing same, and electronic information device

A method for manufacturing an electronic element wafer module in which a plurality of optical elements of at least one wafer shape are positioned on an electronic element wafer with a plurality of electronic elements formed therein, such that the plurality of optical elements face the plurality of respective electronic elements, the method comprising:

• a protective resin film forming step of forming a protective resin film on only light openings of the plurality of wafer-shaped optical elements;
• a light shielding film forming step of filming a light shielding film on an area except for the light openings or an entire area including the light openings ;
• and
• an optical aperture forming step of removing the protective resin film, or removing the protective resin film and a light shielding film material on the protective resin film, to form an optical aperture structure in the light shielding film at the light openings.