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US 2010/0133349 A1Published application
Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component
AssigneeNEC Electronics Corporation
InventorTadayuki Shingai
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor chip, a die pad being mounted with the semiconductor chip with a dielectric interposed therebetween and serving as an antenna, and a molding resin (sealing resin) sealing the semiconductor chip and the die pad. The relative dielectric constant of the dielectric is higher than that of the sealing resin.
Claims17
A semiconductor package comprising:
- a semiconductor chip;
- a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna;
- and
- a sealing resin sealing said semiconductor chip and said die pad,
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
2 more elements
A semiconductor package comprising:
- a first semiconductor chip;
- a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;
- a suspension lead connected to said die pad;
- a second semiconductor chip mounted on said suspension lead and storing an identifier;
- and
- a sealing resin sealing said first and second semiconductor chips and said die pad,
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
4 more elements
An electronic component comprising:
- a mounting board;
- and
- a semiconductor package mounted on said mounting board,
- wherein said semiconductor package includes:
- a semiconductor chip;
- a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna;
- and
- a sealing resin sealing said semiconductor chip and said die pad, and
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
6 more elements
An electronic component comprising:
- a mounting board;
- and
- a semiconductor package mounted on said mounting board,
- wherein said semiconductor package includes:
- a first semiconductor chip;
- a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;
- a suspension lead connected to said die pad;
- a second semiconductor chip mounted on said suspension lead and storing an identifier;
- and
- a sealing resin sealing said first and second semiconductor chips and said die pad, and
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
8 more elements
A method of manufacturing a semiconductor package, comprising:
- mounting a semiconductor chip on a die pad serving as an antenna with a dielectric interposed;
- and
- sealing said semiconductor chip and said die pad with a sealing resin,
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
1 more element
A method of manufacturing a semiconductor package, comprising:
- preparing a die pad serving as an antenna and a suspension lead connected to said die pad;
- mounting a first semiconductor chip on said die pad with a dielectric interposed;
- mounting a second semiconductor chip storing an identifier on said suspension lead;
- and
- sealing said first and second semiconductor chips and said die pad with a sealing resin,
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
3 more elements
A method of manufacturing an electronic component, comprising:
- preparing a mounting board;
- and
- mounting a semiconductor package on said mounting board,
- wherein said semiconductor package includes:
- a semiconductor chip;
- a die pad being mounted with said semiconductor chip with a dielectric interposed and serving as an antenna;
- and
- a sealing resin sealing said semiconductor chip and said die pad, and
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
6 more elements
A method of manufacturing an electronic component, comprising:
- preparing a mounting board;
- and
- mounting a semiconductor package on said mounting board,
- wherein said semiconductor package includes:
- a first semiconductor chip;
- a die pad being mounted with said first semiconductor chip with a dielectric interposed and serving as an antenna;
- a suspension lead connected to said die pad;
- a second semiconductor chip mounted on said suspension lead and storing an identifier;
- and
- a sealing resin sealing said first and second semiconductor chips and said die pad, and
- wherein a relative dielectric constant of said dielectric is higher than that of said sealing resin.
8 more elements
Dependencies are inferred from the claim text.