Wire bonding apparatus, record medium storing bonding control program , and bonding method

3:

• A wire bonding apparatus comprising:
• a moving mechanism for moving, in XYZ directions, a capillary having a wire inserted therethrough and executing bonding on a work;
• an electrical conduction state acquisition device for detecting an electrical conduction state by allowing an electric current to flow from the wire to the work;
• a first means for taking an image of the work;
• a light path device for conducting an elevation image of a vicinity of a tip end of the capillary to the first means;
• a ball formation device for forming a tip end of the wire into a ball of a prescribed shape;
• a second means for opening and closing a plurality of clampers, respectively, for gripping the wire;
• and
• a computer for controlling wire bonding by cutting the wire after bonding between a first bonding point and a second bonding point, said computer including
• a third means for detecting no-tail, in which a tail of the wire fails to have a prescribed length, by processing electrical conduction state signals acquired by the electrical conduction state acquisition device, after bonding to the second bonding point but prior to wire cutting, and indicative of electrical conduction state between a second bonding point and the wire,
• a fourth means for detecting a shape of a tip end of the wire by processing elevation images of the wire in the vicinity of the tip end of the capillary acquired by the first means via the light path device,
• a fifth means for, when no-tail is detected by the third means and an output is made from the fourth means to the effect that a condition of the wire at the tip end of the capillary is not a prescribed condition, paying out the wire at the tip end of the capillary until the wire at the tip end of the capillary attains a prescribed condition, by an up-and-down movement of the capillary caused by the second means and moving mechanism, based on a condition of the wire at the tip end of the capillary detected by the fourth means, and
• a sixth means for reforming the tip end of the wire into a ball of a prescribed shape by the ball formation device based on the tip end shape of the wire detected by the fourth means.

7:

• A record medium storing a bonding control program for a wire bonding apparatus for bonding a wire between a first bonding point and a second boding point, said wire bonding apparatus including
• a moving mechanism for moving, in XYZ directions, a capillary having a wire inserted therethrough and executing bonding on a work,
• an electrical conduction state acquisition device for detecting an electrical conduction state by allowing an electric current to flow from the wire to the work,
• an imaging device for taking an image of the work,
• a light path device for conducting an elevation image of a vicinity of a tip end of the capillary to the imaging device,
• a ball formation device for forming a tip end of the wire into a ball of a prescribed shape,
• a clamper operating device for opening and closing a plurality of clampers, respectively, for gripping the wire, and
• a computer for controlling said wire bonding apparatus;
• said record medium storing a bonding control program executed by said computer, comprising:
• an electrical no-tail detection program for detecting no-tail, in which a tail of the wire fails to have a prescribed length, by processing electrical conduction state signals acquired by the electrical conduction state acquisition device, after bonding on a second bonding point but prior to wire cutting, and indicative of electrical conduction state between the second bonding point and the wire;
• an optical shape detection program for detecting a shape of a tip end of the wire by processing elevation images of the wire in the vicinity of the tip end of the capillary acquired by the imaging device via the light path device;
• a tail re-payout program for, when a no-tail detection is output by the electrical no-tail detection program and an output is made by the optical shape detection program to the effect that a condition of the wire at the tip end of the capillary is not a prescribed condition, paying out the wire at the tip end of the capillary until the wire at the tip end of the capillary attains a prescribed condition, by an up-and-down movement of the capillary caused by the clamper operating device and moving mechanism, based on a condition of the wire at the tip end of the capillary output by the optical shape detection program;
• and
• a no-tail recovery program for reforming the tip end of the wire into a ball of a prescribed shape by the ball formation device based on the tip end shape of the wire output by the optical shape detection program.

11:

• A bonding method for a bonding apparatus for bonding a wire between a first bonding point and a second bonding point, comprising the steps of:
• preparing
• a moving mechanism for moving, in XYZ directions, a capillary having a wire inserted therethrough and executing bonding on a work,
• an electrical conduction state acquisition device for detecting an electrical conduction state by allowing an electric current to flow from the wire to the work,
• an imaging device for taking an image of the work,
• a light path device for conducting an elevation image of a vicinity of a tip end of the capillary to the imaging device,
• a ball formation device for forming the tip end of the wire into a ball of a prescribed shape,
• a clamper operating device for opening and closing a plurality of clampers, respectively, for gripping the wire, and
• a bonding control computer for controlling said bonding apparatus;
• an electrical no-tail detection step for detecting no-tail in which a tail of the wire fails to have a prescribed length by processing electrical conduction state signals acquired by the electrical conduction state acquisition device, after bonding to the second bonding point but prior to wire cutting, and indicative of electrical conduction state between the second bonding point and the wire;
• an optical shape detection step for detecting a shape of a tip end of the wire by processing elevation images of the wire in the vicinity of the tip end of the capillary acquired by the imaging device via the light path device;
• a tail re-payout step for, when a no-tail is detected in the electrical no-tail detection step and a condition of the wire at the tip end of the capillary detected in the optical shape detection step is not a prescribed condition, paying out the wire at the tip end of the capillary until the wire at the tip end of the capillary attains a prescribed condition, by an up-and-down movement of the capillary caused by the clamper operating device and moving mechanism, based on a condition of the wire at the tip end of the capillary detected in the optical shape detection step;
• and
• a no-tail recovery step for reforming the tip end of the wire into a ball of a prescribed shape by the ball formation device based on the tip end shape of the wire detected in the optical shape detection step.