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US 2010/0133231 A1Published application
Processing method and processing system
AssigneeTokyo Electron Limited
InventorsTsuyoshi Ohno, Toshihiko Kikuchi, Machi Moriya, Yoshitaka Saita
Life of this patent
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Abstract
The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.
Claims7
1-36. (canceled)
A method for processing a workpiece, comprising:
- a surface structure measurement step of measuring using Scatterometry a dimension of a surface structure of the workpiece before an etching processing;
- a processing condition setting step of setting a processing condition at the time of an etching processing based on the measurement result of the dimension of the surface structure so that the surface structure of the workpiece after the etching processing has a desired dimension;
- and
- thereafter, an etching step of performing an etching processing for the workpiece under the set processing condition,
- wherein correlation data between the processing condition at the time of the etching processing and an elimination amount of the surface structure of the workpiece by the etching processing is obtained in advance;
- and
- wherein said processing condition setting step sets the processing condition based on the measurement result of the dimension of the surface structure and the correlation data.
4 more elements
(canceled)
-46. (canceled)
Dependencies are inferred from the claim text.