Apparatus, system and method for use in mounting electronic elements
AssigneeCree Hong Kong Limited
InventorsWong Xuan, Xie Jian Hui, Cheng Siu Cheong
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Abstract
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.
Claims24
A surface mount device comprising:
- a casing having a recess formed extending at least partially into said casing;
- and
- first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.
A surface mount device comprising:
- a casing comprising a first surface having a recess extending into the casing;
- and
- first and second leads at least partially encased by said casing, said first lead having a chipset portion at least partially exposed through said recess, said second lead proximate said first lead, said second lead having a head portion exposed through said recess, wherein said chipset portion has at least one indentation.
The device of claim 17, further comprising fill material disposed within at least a portion of said recess, wherein casing material extends through first portions of said first and second indentations and said fill material extends through second portions of said first and second indentations.
A method of manufacturing a surface mount device, comprising:
- providing a first lead element comprising a chipset portion, the chipset portion comprising a first indentation and a second indentation;
- providing a second lead element comprising a head portion;
- encasing a portion of the first and second lead elements in a casing, the first and second lead elements are positioned apart, the area between the first and second elements define an insulation gap, the second indentation partially defines the insulation gap, and the chipset portion and the head portion terminate interior to the casing;
- and
- forming a recess in a first surface of the casing and exposing a portion of the chipset portion, a portion of the head portion, and a portion of the first and second indentations through the recess.
Dependencies are inferred from the claim text.