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US 2010/0132998 A1Published application
Substrate having metal post and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDong Gyu Lee, Jin Won Choi, Young Gwan Ko, Seon Jae Mun, Tae Joon Chung
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Abstract
The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post.
Claims22
A substrate comprising:
- a base substrate having a connecting pad disposed thereon;
- a solder resist layer disposed on the base substrate and having an opening through which the connecting pad is exposed;
- a metal post connected to the connecting pad and protruding upwards from the solder resist layer;
- and
- a solder bump disposed on the metal post to surround an external surface including a top surface of the metal post.
2 more elements
A method of manufacturing a substrate, comprising:
- preparing a base substrate having a connecting pad thereon, forming a solder resist layer on the base substrate, the solder resist layer having a first opening through which the connecting pad is exposed, and forming a seed layer on the solder resist layer including the first opening;
- applying photosensitive resist on the solder resist layer including the first opening, and forming a second opening in the photosensitive resist such that the connecting pad is exposed through the second opening;
- forming a metal post in the second opening to be connected to the connecting pad such that the second opening is partially filled with the metal post;
- applying solder paste on the metal post in the second opening, subjecting the solder paste to a first reflow process to provide a round solder bump, and removing the photosensitive resist and the seed layer;
- and
- subjecting the round solder bump to a second reflow process to provide on a lateral surface of the metal post a solder bump film for preventing oxidation.
3 more elements
Dependencies are inferred from the claim text.