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US 2010/0132995 A1Published application
Wiring board and method of producing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorKentaro Kaneko
Life of this patent
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Abstract
A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.
Claims17
A wiring board comprising:
- wiring layers;
- insulating layers disposed between said wiring layers;
- and
- external connection pads respectively including surface plated layers,
- wherein, in each of said external connection pads in one face of said wiring board, an outer peripheral edge of said external connection pad is retracted from an outer peripheral edge of said surface plated layer toward a center of said external connection pad.
2 more elements
A method of producing a wiring board, comprising:
- (a) sequentially forming surface plated layers and external connection pads on a support member;
- (b) retracting an outer peripheral edge of each of said external connection pads from an outer peripheral edge of corresponding one of said surface plated layers toward a center of said external connection pad;
- (c) forming wiring layers and insulating layers on said support member on which said external connection pads are formed;
- and
- (d) removing said support member.
2 more elements
Dependencies are inferred from the claim text.