Device mounting board and semiconductor module
AssigneeSanyo Electric Co., Ltd.
InventorsKoichi SAITO, Tetsuya YAMAMOTO
Life of this patent
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Abstract
In a semiconductor module having the structure in which a bump electrode provided on a wiring layer is connected to a device electrode provided on a semiconductor device, connection reliability between the bump electrode and the device electrode is improved. An insulating resin layer is provided between the semiconductor device and the wiring layer. The bump electrode, formed integrally with the wiring layer and projected from the wiring layer toward the insulating resin layer, is electrically connected to the device electrode provided on the semiconductor device. Part of the height of the wiring layer on the end side in a bump connection area is lower than that of the wiring in a wiring area extending toward the side opposite to the end side.
Claims8
A device mounting board comprising:
- an insulating resin layer;
- a wiring layer provided on one major surface of the insulating resin layer;
- and
- a bump electrode electrically connected to the wiring layer at the end of the wiring layer and configured to be projected from the wiring layer toward the insulating resin layer, wherein part of the height of the wiring layer on the end side is lower than that of the wiring layer in an area of the wiring layer extending toward the side opposite to the end side.
Dependencies are inferred from the claim text.