Method for preparing a conductive feature on a substrate
AssigneeVipem Hackert GmbH
InventorsJurgen Hackert, Paul Tranter, Joost Hubert Maas
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Abstract
The invention provides method for preparing a conductive device comprising the steps of: (a) providing a non-conductive substrate layer; (b) modifying the surface of the non-conductive substrate layer by means of a laser beam treatment; (c) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal; (d) depositing a second metal on the ink pattern obtained in step (c); and (e) applying a third metal on the second metal by means of electrodeposition. The invention further provides a conductive device obtainable by said method.
Claims26
A method for preparing a conductive device comprising the steps of:
- (a) providing a non-conductive substrate layer;
- (b) modifying the surface of the non-conductive substrate layer by means of a laser beam treatment;
- (c) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal;
- (d) depositing a second metal on the ink pattern obtained in step (b);
- and
- (e) applying a third metal on the second metal by means of electrodeposition.
Dependencies are inferred from the claim text.