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US 2010/0132985 A1Published application
Printed circuit board having metal bump and method of manufacring the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Sam Kang, Jeong Woo Park, Ok Tae Kim, Kil Yong Yun
Life of this patent
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Abstract
The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
Claims18
A method of manufacturing a printed circuit board having a metal bump, comprising:
- forming a recess for creation of the metal bump on a metal carrier;
- forming a barrier layer on the metal carrier including the recess;
- forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern;
- preparing an insulating layer, and transferring the upper circuit layer to the insulating layer;
- and
- removing the metal carrier and the barrier layer.
3 more elements
A method of manufacturing a printed circuit board having a metal bump, comprising:
- forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern;
- forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer;
- preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer;
- removing the first and second carriers;
- and
- removing the first and second barrier layers.
3 more elements
A printed circuit board having a metal bump, comprising:
- an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal;
- wherein
- the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.
Dependencies are inferred from the claim text.