Multilayer printed circuit board

A multilayer printed circuit board comprising:

• a first digital signal circuit formed in a first region of a front surface to process a digital signal;
• a first analog signal circuit formed in a second region of said front surface to process an analog signal;
• a second digital signal circuit formed in a third region of a back surface corresponding to said first region and electrically connected to said first digital signal circuit;
• a second analog signal circuit formed in a fourth region of said back surface corresponding to said second region and electrically connected to said first analog signal circuit;
• an analog ground circuit formed between said front surface and said back surface to ground said first analog signal circuit and said second analog signal circuit;
• and
• first and second digital ground circuits to ground said first digital signal circuit and said second digital signal circuit, wherein
• said first digital ground circuit is arranged between said first digital signal circuit and said analog ground circuit, and
• said second digital ground circuit is arranged between said second digital signal circuit and said analog ground circuit.