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US 2010/0132982 A1Published application
Package substrate including solder resist layer having pattern parts and method of fabricating the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Hyun Cho, Je Gwang Yoo, Tae Eun Chang, Sang Soo Lee, Jung Woo Lee, Dae Young Lee, Jae Joon Lee
Life of this patent
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Abstract
Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.
Claims20
A package substrate including a solder resist layer having pattern parts, comprising:
- a base substrate having an insulating layer and a circuit layer formed on the insulating layer;
- and
- a first solder resist layer formed on a first layer of the base substrate on which an electronic component is to be mounted and having a first opening for exposing a first pad of the circuit layer formed on the first layer of the base substrate, a surface of the first solder resist layer having pattern parts.
A method of fabricating a package substrate including a solder resist layer having pattern parts, comprising:
- preparing a base substrate including an insulating layer and a circuit layer formed on the insulating layer;
- and
- forming a first solder resist layer having pattern parts on a first layer of the base substrate on which an electronic component is to be mounted, through screen printing using high-viscosity solder resist ink containing a filler having high heat conductivity.
Dependencies are inferred from the claim text.